The production of chips and integrated circuits (ICs) requires extremely sophisticated measurement equipment and solutions, with accuracy at the nanoscale or even sub-nanometer level. These solutions are tightly integrated into the manufacturing process in a cleanroom environment to control each step of deposition, photolithography, and doping.

An integrated circuit (IC) is an electronic device comprising multiple functional components such as transistors, resistors, capacitors, etc., on a silicon semiconductor substrate and enclosed within a package with many pins. Currently, the critical size of an IC (or the smallest size of IC elements) is around 10 nanometers (nm: 10⁻⁹ m), an extremely small size.
Radio transistors consist of a printed circuit board with discrete transistors, resistors, capacitors, and diodes mounted on it and connected by wires. Current ICs are highly integrated and miniaturized, measuring only about 1/55,000th the size and 3 billionths the area of a radio transistor. Thanks to this high level of integration, ICs with embedded multiple functions have significantly improved the performance of electronic devices.

SEMIKI suggests essential measurement equipment and solutions for chip and integrated circuit manufacturing plants:

A. In-line Metrology: These are devices that automatically scan and inspect each wafer after each critical production stage.

1. Critical Dimension and Geometric Measurement (CD Metrology)

• Critical Dimension Scanning Electron Microscope for CDs (CD-SEM):
  • Purpose: Precisely measuring the dimensions of circuit traces, semiconductor gates, and other microstructures after photolithography and etching processes. This is standard equipment to ensure that components are within design tolerances.
  • Solution: Fully automated, integrated wafer loading robots provide instant process control (SPC) statistical data.      

2. Thin Film Measurement and Optical Properties (Thin Film & Optical Metrology)

• Spectroscopic Ellipsometry and Reflectometry Systems:
  • Purpose: The thickness and optical properties (refractive index) of thin material layers (dielectrics, polysilicon, metals) deposited on a wafer are measured. This thickness determines the electrical performance of the chip.
  • Solution: Non-contact, high-speed measurement allows for the inspection of measurement points on the wafer using the 100%.

3. Check the alignment (Overlay Metrology)

• Overlay Measurement Systems:
  • Purpose: Ensure that the different layers of electronic circuitry are perfectly stacked on top of each other during the multilayer lithography process. Alignment errors can render the chip inoperable.
  • Solution: Utilizing advanced image-based or optical diffraction measurement technologies to achieve sub-nanometer accuracy.

4. Electrical Metrology and Resistance Measurement

• Four-Point Probe System or Sheet Resistance Metrology:
  • Purpose: Measure the resistivity of semiconductor layers after ion implantation or metal deposition to verify the desired conductivity.

B. Defect Inspection Equipment

Detecting even the smallest defects (dust particles, cracks, structural flaws) is crucial in chip manufacturing.

• Wafer surface defect inspection systems:
  • Purpose: Scan the entire wafer surface using laser or advanced optical technology to identify the location and type of defects.
  • Solution: Automatic Defect Classification (ADC) automatically classifies defects and sends the data to CD-SEM machines for root cause analysis.
• Package Inspection Systems: Perform physical defect checks after the chip is cut from the wafer and packaged.

C. Measurement equipment in the QA/QC and Failure Analysis (FA) Laboratory

These devices are often used for in-depth analysis when errors occur or to verify final quality.

• Transmission electron microscopes (TEM) and high-resolution SEMs:
  • Purpose: Analyze the material structure at the atomic level, examining cross-sections of the chip to find microscopic flaws.
• Industrial X-ray/CT Scanning System:
  • Purpose: Inspect the internal structure of a packaged chip without destroying it.
• Chemical composition analysis system (EDS/XRF):
  • Purpose: Identify the material composition and search for contaminants.
• Automatic Electrical Parameter Testing System (ATE – Automatic Test Equipment) / Parametric Testers:
  • Purpose: The final test to ensure the chip is functioning correctly involves measuring voltage, current, and performance.

X-RAY CT 3D CT scanner NIKON XT-V-160, XT-V -130C

D. Comprehensive Essential Measurement Solutions

1. Cleanroom Environmental Monitoring: Use Particle Counters To ensure an environmental standard of Class 1 or lower, and to prevent pollution.

Kanomax 3889 6-channel particle counter (0.3, 0.5, 1.0, 3.0, 5.0, 10.0μm)

1. MES (Manufacturing Execution System) system: Integrate all measurement data from in-line devices to monitor production yield (yield management), trace the source of defects, and optimize the chip manufacturing process.

Contact Semiki for advice and to purchase measurement equipment for your semiconductor and chip manufacturing plant.
Semiki is a leading distributor and provider of industrial measurement equipment solutions in Vietnam, particularly in the precision and electronics industries.
Semiki typically offers product lines tailored to the quality control needs of the semiconductor industry, including precision measuring instruments, industrial microscopes, and non-destructive testing solutions.

When contacting us, you should clearly describe your needs (e.g., need for thin-layer thickness gauge, CD-SEM meter, or defect inspection microscope) so that Semiki's sales engineering team can advise on the most suitable solution and provide the most accurate price quote.

Business email: [email protected]

Phone number (Hotline): +84 979 761 016.

Website: You can find out more details and send a consultation request via Semiki.com.