In the PCBA (printed circuit board) manufacturing process, measurement and quality control steps are crucial to ensuring the product functions correctly and reliably. The main measurement steps include:
1. Pre-production and material testing phase
Design document review (DFM): Analyze the manufacturability of PCB (printed circuit board) and BOM (bill of materials) designs to identify potential problems before beginning mass production.
Incoming Material Inspection (IQC): Inspect the specifications, models, quantities, and quality of all electronic components and bare PCBs. Moisture-sensitive components are stored in a humidity-controlled dry cabinet.
2. Assembly stage (SMT and THT)
Solder paste print test (SPI): Use an automatic solder paste tester to ensure the solder paste is printed accurately, in the correct position, and at the right thickness.
Automated optical inspection (AOI) after component placement: The camera scans the circuit board to detect errors such as missing components, incorrect placement, wrong orientation, or solder joint errors immediately after the surface mount technology (SMT) process.
X-ray examination (AXI): For complex components like BGA (Ball Grid Array), X-ray inspection is used to detect hidden defects such as solder gaps or missing solder balls.
X-RAY CT 3D CT scanner NIKON XT-V-160, XT-V -130C
Manual inspection (if necessary): Inspect solder joints and through-hole (THT) components visually or under a microscope after wave soldering or manual soldering.
3. Final inspection and testing phase
In-circuit testing (ICT): Using specialized equipment to check for electronic faults such as short circuits, open circuits, resistance and capacitance values, and the presence of components, ensures the circuit functions as designed.
Functional Testing (FCT): Conduct comprehensive functional testing of the PCBA by simulating a real-world operating environment to ensure the product meets performance requirements.
FCT machine for testing PCB component functionality - Semiki ver.5
Reliability testing:
Temperature/humidity test: Test the board's performance under extreme temperature and humidity conditions.
Vibration test: Evaluate the vibration damping capabilities of the circuit board.
Burn-in test: Operate the circuit board for an extended period under load conditions to detect faults early.
The Malcom RCX-1 and DS-11S devices are used in the temperature control and soldering process stages of PCBA production to ensure solder quality and board reliability. Specifically:
Malcom RCX-1 (Reflow Checker)
RCX-1 is a modular reflow soldering oven (SMT surface mount system) testing and monitoring system. It plays a crucial role in ensuring accurate and uniform temperature configuration of the soldering oven.
Malcom RCX-1 (6 Channel) PCB reflow oven test system (0～500℃)
Control the temperature of the reflow oven: The basic function of the RCX-1 is to measure and record the actual temperature profile inside the reflow soldering oven. By running the device through the oven on a conveyor belt like a regular PCB, users can compare the actual temperature curve with the ideal temperature curve to adjust the oven's temperature zones.
Measure other parameters: The RCX-1 has a modular design, allowing users to add optional sensors to measure other parameters, including:
Wind speed (RCX-W): Measure the speed of the hot air flow inside the oven to ensure even and efficient heat distribution.
Oxygen concentration (RCX-O): Measuring the oxygen concentration (usually nitrogen gas) in the furnace is crucial for controlling the oxidation of the solder joint, especially important for lead-free solder pastes.
Camera observation (RCX-C): Record the reflow soldering process in real time to visually observe the melting and formation of the solder joint.
Vibration measurement (RCX-V): Detecting abnormal vibration in the conveyor belt can affect the quality of the weld.
Malcom DS-11S (Dip Tester)
The DS-11S is a specialized testing device for wave soldering or selective soldering processes, commonly used for through-hole (THT) components.
MALCOM DS-11S Dip Tester Soldering Temperature Analyzer (0～300℃)
Measure the immersion temperature and time: The device simulates the process of a PCB passing through a solder bath, measuring the maximum solder temperature and the dip time of the board in contact with the solder wave.
Control the preheating temperature: The DS-11S also measures the preheating temperature on the PCB surface before it enters the soldering bath, helping to control the rate of temperature increase and activate the flux.
Measure size and speed of movement: The device can measure the size of the weld wave (X, Y nozzle size for selective welding) and the speed of the conveyor belt moving through the weld pool.
Analysis software: The collected data is transmitted to a computer via USB or Bluetooth for analysis, allowing for a Pass/Fail (OK/NG) assessment and the creation of detailed temperature profiles for process management and adjustment.
These measurement steps help detect and prevent defects at each stage, thereby improving the overall quality of the finished PCBA product.
You can contact Semiki Measurement Equipment Co., Ltd. (Semiki ins.) for consultation and solutions for measuring equipment in PCB manufacturing. Semiki is an authorized distributor of measurement equipment from Japan, including products from Malcom, Hioki, Kikusui, etc., and specializes in providing precise testing and measurement solutions for the electronics industry in Vietnam.
Semiki offers a range of measurement solutions, including automated optical inspection (AOI) systems, in-circuit inspection (ICT), and specialized equipment such as the Malcom RCX-1 and DS-11S, and the aforementioned PCU-285 viscometer, to help you control quality in your PCBA manufacturing process.
You can contact Semiki using the following information:
Headquarters in Ho Chi Minh City: 12th Floor, Tower A2 – Viettel Building, 285 Cach Mang Thang Tam Street, Hoa Hung Ward, District 10, Ho Chi Minh City, Vietnam.
Hanoi Office: 9th Floor – 3D Building, No. 3 Duy Tan Street, Cau Giay Ward, Hanoi City.
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